RoHS指令发布以来，欧盟委员会针对豁免材料陆续发布了8次决议，分别是：2005/717/EC 、2005/747/EC、2006/310/EC、2006/690/EC、2006/691/EC、2006/692/EC、2008/385/EC、2009/443/EC，这些决议中的豁免共计38项。其中两项豁免取消，36项豁免有效实施。
第 1 项至第38项豁免如下：
1．小型日光灯中的汞含量不得超过5毫克/灯；(2002/95/EC)
Mercury in compact fluorescent lamps not exceeding 5 mg per lamp.
2．一般用途的直立日光灯中的汞含量不得超过： (2002/95/EC)
- 卤化磷酸盐（Halophosphate）< 10毫克
- 正常的三磷酸盐(Triphosphate with normal lifetime)< 5毫克
- 长效的三磷酸盐(Triphosphate with long lifetime)< 8毫克
Mercury in straight fluorescent lamps for general purposes not exceeding:
· Halophosphate 10 mg;
· Triphosphate with normal lifetime 5 mg;
· Triphosphate with long lifetime 8 mg.
3．特殊用途的直式日光灯中的汞含量；(2002/95/EC)
Mercury in straight fluorescent lamps for special purposes.
4．本附录中未特别提及的其它照明灯中的汞含量； (2002/95/EC)
Mercury in other lamps not specifically mentioned in this Annex.
5．阴极射线管（cathode ray tubes）、电子部件（electronic components）和发光管（fluorescent tubes）的玻璃内的铅含量；（2002/95/EC）
Lead in glass of cathode ray tubes, electronic components and fluorescent tubes.
6．钢合金中的铅含量不应该超过0.35%、铝合金中铅含量不应该超过0.4%，铜合金中的铅含量不应该超过4%；（2002/95/EC）
Lead as an alloying element in:
· Steel containing up to 0.35 % lead by weight;
· Aluminium containing up to 0.4 % lead by weight;
· Copper alloy containing up to 4 % lead by weight.
7．--高温融化型焊锡中的铅（如：锡铅焊料合金中铅含量超过85%）；（2005/747/EC）
--用于服务器（servers），存储器（storage）和存储阵列（storage array systems）和交换、信号产生和传输，以及电信网络管理的网络基础设施设备（network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunications）中焊料中的铅；（2005/747/EC）
--电子陶瓷产品中的铅（如：高压电子装置）；（2005/747/EC）
· Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead).
· Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission as well as network management for telecommunication.
· Lead in electronic ceramic parts (e.g. piezoelectronic devices).
8．电气连接的触点(electrical contacts)中镉及镉化合物的使用不限，以及91/338/EEC指令禁止以外的镉镀层中的镉；（2005/747/EC）
Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to restrictions on the marketing and use of certain dangerous substances and preparations.
9．在吸收式电冰箱中作为碳钢冷却系统防腐剂的六价铬。(2002/95/EC)
Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators.
9a．聚合物(Polymeric)中十溴二苯醚的应用。(2005/717/EC)
DecaBDE in polymeric applications.
[注：2008年4月初，欧洲法院（European Court of Justice）发布公告：欧盟委员会2005
年公布的针对十溴二苯醚的豁免项目存在程序性的错误，因此废除委员会决议2005/717/EC
附件第9a条对聚合物中十溴二苯醚的豁免，裁定将于2008年7月1日执行，因此聚合物中十
溴二苯醚的豁免只能延续至2008年6月30日。]
9b.用于铅青铜轴承外壳（lead-bronze bearing shells and bushes）的铅；（2005/717/EC）
Lead in lead-bronze bearing shells and bushes.
11、顺应针联接系统(compliant pin connector systems)中使用的铅；（2005/747/EC）
Lead used in compliant pin connector systems.
12、热导项枪钉模组(thermal conduction module c-ring)涂层中所用的铅；（2005/747/EC）
Lead as a coating material for the thermal conduction module c-ring.
13、光学玻璃及滤光玻璃（optical and filter glass）中所用的铅；（2005/747/EC）
Lead and cadmium in optical and filter glass.
14、微处理器针脚及封装联接所使用的含有80-85%铅的复合（含有超过两种组分）焊料中的铅；（2005/747/EC）
Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight.
15、倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅；（2005/747/EC）
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
16.直立式的钨丝灯，若其灯管含有硅酸盐涂布，则可含铅；(2006/310/EC)
Lead in linear incandescent lamps with silicate coated tubes.
17.卤化铅作为发光源，并用于专业探照用途的HID灯中，则可含铅；(2006/310/EC)
Lead halide as radiant agent in High Intensity Discharge (HID) lamps used for professional reprography application.
18.若铅作为触发源而包含于荧光粉中（铅含量1wt％或更少），且此荧光粉是用于含有如BSP(BaSi205：Pb)等磷光剂的太阳灯（sun tanning lamps）的放电灯管中，或者此荧光粉是用于含有如SMS（（Sr，Ba）2MgSi207：Pb）等磷光剂的特殊灯，这些特殊灯的用途包括用于含二氮化合物的电子翻印、平板印刷、补虫灯、光化学或医疗疗程等等，则可含铅；(2006/310/EC)
Lead as activator in the fluorescent powder (1% lead by weight or less) of discharge lamps when used as sum tanning lamps containing phosphors such as BSP (BaSi2O5:Pb) as well as when used as speciality lamps for diazo-printing reprography, lithography, insect traps, photochemical and curing processes containing phosphors such as SMS ((Sr,Ba)2MgSi2O7:Pb).
19.铅作为汞齐（即汞合金）中的特定成分，如PbBiSn－Hg或PbInSn－Hg中，且此汞齐作为主要汞齐，或如PbSn－Hg用于辅助汞齐中，且这些汞齐使用于节能灯泡（ESL）中，则可含铅；（2006/310/EC）
Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact Energy Saving Lamps (ESL).
20. LCD中用于保护平面荧光灯（flat fluorescent lamps）的前后支撑物的玻璃中可含氧化铅。(2006/310/EC)
Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCD).
21. 用在硼硅酸盐玻璃表面瓷釉上的印刷油墨中的铅及镉。（2006/691/EC）
Lead and cadmium in printing inks for the application of enamels on borosilicate glass.
22.在光纤通讯系统中的稀土铁石榴石法拉第旋转器中的杂质铅。（2006/691/EC）
Lead as impurity in RIG (rare earth iron garnet) Faraday rotators used for fibre optic communications systems.
23.小螺距零部件表面处理中的铅（螺距不超过0.65mm且带镍铁边框的连接器，以及螺距不超过0.65mm且带铜边框的连接器不在豁免范围之内）。（2006/691/EC）
Lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with NiFe lead frames and lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with copper lead-frames.
24. 通孔盘状及平面陈列陶瓷多层电容器的焊料所含的铅。（2006/691/EC）
Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors.
25. 等离子显示屏（PDP）及表面传导式电子发射显示器（SED）构件中所用的氧化铅，比较典型的例子：玻璃前后绝缘层中的氧化铅、总铅电极中的氧化铅、黑条（彩色显像管）中的氧化铅、地址电极中的氧化铅、阻挡层肋柱中的氧化铅、密封玻璃料中的氧化铅，以及封装玻璃中的氧化铅、环状玻璃中的氧化铅、印墨中的氧化铅。（2006/691/EC）
Lead oxide in plasma display panels (PDP) and surface conduction electron emitter displays (SED) used in structural elements; notably in the front and rear glass dielectric layer, the bus electrode, the black stripe, the address electrode, the barrier ribs, the seal frit and frit ring as well as in print pastes.
26.蓝黑灯管（BLB）玻璃封装中的氧化铅。（2006/691/EC）
Lead oxide in the glass envelope of Black Light Blue (BLB) lamps.
27. 用作高性能扬声器（用在长时间操作125分贝以上的音响系统）的传感器中焊料的铅合金。（2006/691/EC）
designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers.
28. 用于防腐或屏蔽电磁干扰，用在特定仪器设备中（欧盟指令2002/96/EC第三类规定的IT和通讯设备）的金属片或金属扣件上的防腐涂层中的六价铬。这项豁免将于2007年7月1日停止。（2006/692/EC）
Hexavalent chromium in corrosion preventive coatings of unpainted metal sheetings and fasteners used for corrosion protection and Electromagnetic Interference Shielding in equipment falling under category three of Directive 2002/96EC ) (IT and telecommunications equipment).Exemption granted until 1 July 2007.
IT和通讯设备）的金属片或金属扣件上的防腐涂层中的六价铬。这项豁免将于2007年7月1日停止。
29. 水晶玻璃中铅含量的限定依照欧盟指令69/493/EEC附件I（第1、2、3、4类）。（2006/690/EC）
Lead bound in crystal glass as defined in Annex I (Categories1, 2, 3, and 4) of Council Directive 69/496/EEC
30. 用于位于音压级(SPL)大于或等于 100 分贝的大功率扬声器音圈上的电导体的电气电气机
械焊点的镉合金。
Cadmium alloys as electrical/mechanical solder joints to electrical conductors located directly on the voice coil in transducers used in high-powered loudspeakers with sound pressure levels of 100 dB (A) and more.
31. 用于无汞平板荧光灯（例如：用于液晶显示器、设计或工业照明）的焊料中的铅。
Lead in soldering materials in mercury free flat fluorescent lamps (which e.g. are used for liquid crystal displays, design or industrial lighting).
32. 用于氩和氪激光管防护窗组合件的封装玻璃料里的铅的氧化物。
Lead oxide in seal frit used for making window assemblies for Argon and Krypton laser tubes.’
33.用以焊接电源变压器中直径100微米及以下的幼身铜线的焊料中的铅。
Lead in sol ers for the soldering of thin copper wires of 100 μm diameter and less in power transformers.
34.水泥制微调电位器组件中的铅。
Lead in cermet-based trimmer potentiometer elements.
35. 专业音频设备的光耦合器中光敏电阻的镉，直至2009年12月31日。
Cadmium in photoresistors for optocouplers applied in professional audio equipment until 31 December 2009.
36.直流等离子显示器中，作为阴极溅射抑制剂中的汞含量最高可达30毫克，直至2010年7月1日。
Mercury used as a cathode sputtering inhibitor in DC plasma displays with a content up to 30 mg per display until 1 July 2010.
37. 以硼酸锌玻璃体为基础的高压二极体的电镀层的铅含量。
Lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body.
38. 用氧化铍连接铝制成的厚膜浆料中镉和氧化镉的含量。
Cadmium and cadmium oxide in thick film pastes used on aluminium bonded beryllium oxide.’